TSMC could be inching closer to making 'all American' chips — report says it is accelerating an advanced packaging facility in Arizona

TSMC Arizona Fab: Faster Path to "All-American" Chips?

The winds of change may be blowing faster in the Arizona desert. According to recent reports, TSMC is potentially accelerating the development of its advanced packaging facility in Arizona. This move could mean that we see processors packaged on American soil as early as 2028!

This is a significant development, potentially putting TSMC ahead of its partner, Amkor, in the race to bring advanced chip packaging to the US. For those unfamiliar, advanced packaging is a critical step in the chip manufacturing process. It essentially connects the processed silicon die to the outside world, allowing it to communicate with other components in a device.

Why is this important? Bringing advanced packaging to the US, alongside chip fabrication, represents a crucial step towards creating a more resilient and geographically diverse semiconductor supply chain. For years, concerns have grown about the concentration of chip manufacturing in Asia. This move by TSMC could help alleviate those concerns and bolster American technological independence.

While 2028 may seem like a long way off, accelerating the project shows TSMC's commitment to this important initiative. It's a development worth watching closely, as it could reshape the future of chip manufacturing in the United States.

Source Intel: Read Original