Hot Chips 2026: SK hynix pushes hybrid bonding to HBM5 as AI memory hits 775-micron ceiling — firm extends MR-MUF through Nvidia Rubin
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⚡ Quick Hits
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* SK hynix will implement hybrid bonding for HBM5 to bypass current physical height constraints.
* The company's proven MR-MUF packaging technology is being extended to support Nvidia's upcoming Rubin GPUs.
* These packaging innovations are vital