Hardware

Samsung introduces SOCAMM2 LPDDR5X memory module for AI data centers — new standard set to offer reduced power consumption and double the bandwidth versus DDR5 RDIMMs

Samsung introduces SOCAMM2 LPDDR5X memory module for AI data centers — new standard set to offer reduced power consumption and double the bandwidth versus DDR5 RDIMMs

💡 Verdict: Samsung's SOCAMM2 LPDDR5X memory module aims to bring improved power efficiency and doubled bandwidth to AI data centers compared to DDR5 RDIMMs. Check Price: LPDDR5X ⚡ Quick Hits * SOCAMM2 offers improved power efficiency for data centers. * LPDDR5X provides double the bandwidth compared to DDR5 RDIMMs. * The new module
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New 1.4nm nanoimprint lithography template could reduce the need for EUV steps in advanced process nodes — questions linger as no foundry has yet committed to nanoimprint lithography for high-volume manufacturing

New 1.4nm nanoimprint lithography template could reduce the need for EUV steps in advanced process nodes — questions linger as no foundry has yet committed to nanoimprint lithography for high-volume manufacturing

💡 Verdict: Dai Nippon Printing (DNP) has announced a 1.4nm nanoimprint lithography template, potentially reducing reliance on EUV in advanced process nodes, although foundry adoption remains uncertain. Check Price: 1.4nm Template ⚡ Quick Hits * DNP's template aims for mass production by 2027. * The technology could decrease the need
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Arctic launches its best thermal paste yet for chips of all types — claims new MX-7 formulation runs 3% cooler than its predecessor

Arctic launches its best thermal paste yet for chips of all types — claims new MX-7 formulation runs 3% cooler than its predecessor

💡 Verdict: The Arctic MX-7 thermal paste is the successor to the MX-6, promising 3% better cooling performance. Check Price: MX-7 ⚡ Quick Hits * New formulation for improved thermal conductivity. * Aims for better cooling than its predecessor, MX-6. * Suitable for various chips. Arctic has released its latest thermal paste, the MX-7, building
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