SK hynix to build first U.S. packaging plant for HBM — plugs critical hole in U.S. supply chain, $3.9B investment challenges TSMC and reshapes AI supply chains

⚡ Quick Hits

• SK hynix is investing $3.9 billion in a U.S. manufacturing plant.
• The plant will specialize in 2.5D advanced packaging for HBM.
• The facility will be located in West Lafayette, Indiana.

SK hynix is expanding its HBM (High Bandwidth Memory) production with a significant $3.9 billion investment in its first U.S.-based manufacturing facility. The new plant, located in West Lafayette, Indiana, will focus on 2.5D advanced packaging technology, a crucial step in producing HBM. This move addresses a critical gap in the U.S. supply chain for advanced memory solutions and positions SK hynix to better compete with companies like TSMC in the rapidly evolving AI hardware landscape.