Google reportedly books Intel for packaging more than 3 million TPUs in 2028 — SK hynix is testing Intel's EMIB packaging for HBM integration
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Verdict: Google has reportedly secured Intel to package over 3 million Tensor Processing Units by 2028, while SK hynix explores Intel's EMIB technology for seamless High Bandwidth Memory (HBM) integration.
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* Google has reportedly commissioned Intel to package over 3 million TPUs by