Chinese semiconductor industry gears up for domestic HBM3 production by the end of 2026 ā CXMT to produce chips, while Naura, Maxwell, and U-Preseason design tools for assembly
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Verdict: China's semiconductor industry aims to domestically produce HBM3 memory and the necessary assembly tools by the end of 2026.
ā” Quick Hits
- China's semiconductor industry is striving for self-sufficiency in HBM3 memory production.
- CXMT is expected to handle chip production.
- Naura, Maxwell, and U-Preseason will design assembly tools.
China Aims for Domestic HBM3 Production by 2026
The Chinese semiconductor industry is reportedly making strides towards localizing the production of High Bandwidth Memory 3 (HBM3). This initiative extends beyond just chip manufacturing, encompassing the development of essential tools required for HBM assembly.
While specific details regarding the progress of these projects remain limited, the ambition is clear: to establish a domestic supply chain for HBM3 memory. CXMT is expected to be at the forefront of HBM3 chip manufacturing, while Naura, Maxwell, and U-Preseason will focus on designing the assembly tools. The goal is to have the entire process self-reliant by the end of 2026.
*Source Intel: Read Original*
